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“If this is what is happening to Japanese equipment vendors, what chance do Chinese companies have? Packaging may prove to be key Skeptics of China’s prospects might take a long look at China’s success in packaging, an area where China is succeeding, in part by acquisitions of Asia-based companies, notably STATS Chip PAC (Singapore), which was acquired by Jiangsu Changjiang Electronics Technology Co. Separately, SMIC and JCET formed a joint venture to focus on chip scale packaging, wafer bumping, and fan-out wafer level packaging.
The packaging joint venture is located 90 minutes from Shanghai, said Sonny Hui, senior vice president of worldwide marketing at SMIC.
“China could be the 3D NAND capital of the world,” Mc Clean said at The Con Fab conference in Las Vegas. “Since the 3D NAND makers are not pushing feature sizes, it doesn’t raise red flags like if Chinese companies wanted Fin FET technology. However, Mc Clean said the 3D NAND market is not immune to the oversupply issues that now face the DRAM makers. China’s domestic IC market is slightly more than 0 billion, Mc Clean said, while chip production in China was about billion last year, representing just under 5 percent of worldwide production (Figure 1).
Sam Wang, a Gartner analyst who focuses on foundries, pointed out at Semicon West that China’s semiconductor industry faces continued challenges in a hotly contested foundry market.
It “pivoted” on the advice of an early customer, which fortunately already had developed the “ink” which under UV light would form a uniform encapsulation layer for the large OLED substrates required for TVs and other large display applications.
Two display companies in China identified Kateeva as a strategic partner, which allowed Kateeva to raise money from private Chinese VC funds, rather than taking money from regional government funds which might have asked Kateeva to locate its manufacturing operations in their local area. S.-based venture capital funds to favor software companies over manufacturing-focused opportunities.
Robert Maire, who consulted for SMIC on its initial public offering in the United States, spoke at length about China at the SEMI Advanced Semiconductor Manufacturing Conference (ASMC) in Saratoga Springs, N. Amid the mergers and acquisition frenzy of last year, China managed to pull off the acquisitions of CMOS image sensor vendor Omnivision, memory maker ISSI, the RF business of NXP, Pericom Semiconductor, and Mattson Technology.
(Mc Clean said he believes that if the Omnivision acquisition were attempted in today’s more China-wary environment that Washington would block the deal).
That government support reduced the investment risks in ways that are not readily seen in Japan or the United States, he said. professor who had developed ink jet technology for large formats.